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TSSD®

Thermal adhesive bonding boss

- Fastening element and process specifically for sandwich elements
- Broad application range
- Especially suitable for honeycomb structures
- High transmittable tensile forces
- No corrosion
- Can be used as screw boss or as direct fastening element

The EJOT TSSD® thermal adhesive bonding boss

The EJOT TSSD® (thermal adhesive bonding boss) product and corresponding joining process have been developed with the objective to join components of which one is made of fibre-reinforced plastics.
The process is suitable for sandwich elements with honeycomb and foam core structures (having different top coats) as well as for CRP and GRP plastic materials.
During the joining process the plastic boss (made of thermoplastic) is installed into the plastic component with a certain rotation speed and axial load.

Dokument

Produktblad

TSSD®.pdf